HP & AMD Scholarship 2008
1. When is the scholarship application submission deadline?
The scholarship application submission duration is from 11 August 2008 to 30 September 2008.
2. What is the scholarship value?
Successful recipients will each receive a scholarship package worth RM25,000.3. How will the scholarship be disbursed?
The scholarships shall be disbursed on a lump sump basis and shall be paid directly to the recipients.
4. Is this a bonded scholarship?
No. This is a non-bonded scholarship.
5. Can I apply if I am a part-time student?
Yes. This scholarship program is opened to all students who fulfill the eligibility criteria.
6. Is this scholarship for undergraduate students only?
No. This scholarship program is opened to both undergraduate & postgraduate students.
7. How do I apply?
Application is via online submission ONLY at HP & AMD Scholarship 2008 with certified true copies of relevant documents mailed by post. Application is considered complete when both online application and hard copy of supporting documents are received.
8. How many applications can I submit?
Each applicant is allowed to apply ONCE only.
May I just enquire if this scholarship is available for those taking SPM this year?
Or do we only apply after A levels or Matriculation?
Also, is it available for any specific course or any university course?
Thank you.